Description:
Molded from LDPE, low cost and widely used to pack products like PC board, IC integrated circuit, CD driver, HD etc., which easily get damaged by collision, pressure, attrition and static.
Features
* Material: LDPE
* Surface resistance: 108-1011.
* Available in open flat, envelope, roll.
* Sizes are on request.
* Bubble diameter: 6mm or 30mm, other diameter is on request.
* Bubble height: 2-15mm, other height is on request.
* Single-sided & double-sided bubble
* Opening: at long side, or open at short side
* Packing: 100pcs/bag, or 200pcs/bag
* Antistatic, shockproof, light weight, low cost.
* Mainly used for the packaging of electronic component and PC boards.
* Color: Pink, White, Blue, Red…
